AMD just announced its new 3D chiplet technology, developed in collaboration with TSMC. A new design and manufacturing process that can revolutionize processors and bypass Moore's Law.

Instead of making the CPUs have a larger area by adding new items or expanding the cache or logical drive, the new technique stacks the components like a sandwich: using vertical space in layers instead of increasing the total surface of the chip on a flat wafer.

The technology is actually from TSMC, but AMD appears to be the first CPU manufacturer to take advantage of the new process by introducing a new "vertical L3 cache" in its Ryzen processors.
Without going too much into the architecture and technical details, the cache is the part of the processor that stores the most used data and instructions for the processor at all times, so that it is easier and faster to access them.

The larger the cache, the more data. And the more data, the less time the processor can find what you need without having to access new data in main RAM, which takes longer and slows performance.

But according to Su, they have vertically stacked a 64MB SRAM node on the CCD - the part of the CPU that contains the process cores. According to AMD, they have thus been able to triple the L3 cache available on a 16-core processor, going from a maximum of 64 MB to 192 MB.

The change has a dramatic effect on process ability. In a Gear of War 5 demo, AMD demonstrated that there is a performance increase of approximately 12%

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